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APPLICATION WORKFLOW

Cold mounting for heat- or pressure-sensitive specimens

A preparation route for PCB sections, electronic components and other sensitive samples.

01Locate the region of interest02Assess material constraints03Cast and cure in the mold04Prepare the surface
Process overview: advance step by step and confirm each stage before moving on.
Locate the region of interest
Assess material constraints
Cast and cure in the mold
Prepare the surface

Application example for discussing a method. This is not a customer test report or a fixed recipe. Confirm conditions, methods and acceptance requirements before use.

  1. Locate the region of interest

    Determine how to sample the specimen from its dimensions and the inspection location.

  2. Assess material constraints

    Consider cold mounting for specimens that cannot tolerate heat or pressure.

  3. Cast and cure in the mold

    Select a compatible resin. Mix and cure in accordance with its instructions.

  4. Prepare the surface

    After curing, choose grinding, polishing and observation steps according to the material and objective.

Instrument references

Records to retain

  • Specimen ID, material, sampling position and orientation.
  • Instrument model, consumable batch, actual settings and operator.
  • Surface condition, observations and corrective actions at each stage.
  • Images, raw measurements and the method version used.

Interpreting results

Evaluate results against the agreed method and acceptance requirements. No measured outcomes or customer results are asserted by this example.

Source reference www.cnnoet.com ↗ · Compiled from public references; see the source link

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