Product photography / image presentation, not a live operation
Grinding & polishing
ZMP-1000D
Automatic precision controlled grinding machine
The ZMP-1000D is a PLC-controlled precision grinder for controlled specimen thinning and grinding to a defined depth.
TECHNICAL DATA
Technical specifications
Specifications are compiled from published references. Confirm configuration, options and delivery requirements with an engineer.
| Parameter | Specification / configuration |
|---|---|
| Model | ZMP-1000D |
| Machine body configuration | Benchtop (touchscreen PLC control) |
| Clamping capacity | 4 specimens (custom specimen sizes available) |
| Pressure application | Pneumatic (individual / central loading) |
| Operation | Automatic / semi-automatic |
| Control system | Color touchscreen, PLC control |
| Grinding method | Programmed automatic / semi-automatic (two grinding modes) |
| Grinding tracking | Digital display and real-time plot |
| Resolution | 1μm |
| Grinding accuracy | 10μm/ (optional 2μm) |
| Grinding disc speed | 50-1500 rpm |
| Grinding head speed | 20-200 rpm |
| Abrasive dosing | Two-channel automatic dosing |
| Dosing interval | Programmable; minimum dosing interval 0.1S |
| Dosing time | Programmable; minimum spray interval 0.1S |
| Preparation time | 0-9999 s |
| Main unit power | 1200W |
| Specimen preparation diameter | Φ30mm (special sizes optional) |
| Grinding disc diameter | 230mm |
| Power supply | 220V/50HZ |
| Dimensions | 650mm*500mm*680mm (L * W * H ) |
| Net weight | 71.5KG |
| Gross weight | 82KG |
Specifications checked 2026-11-12 based on the archived public product page.
Working principle
Stepwise grinding & polishing
Each step removes the damage left by the previous one, rotating the direction by 90°, until only negligible relief remains and the structure is not smeared.
- P240 → P2000
- 90° rotation
- Diamond to mirror
Product overview
Using a touchscreen PLC system, the ZMP-1000D automatically controls the amount of material removed during grinding. It is intended for research work requiring controlled reduction in the thickness of precision components or preparation to a specified grinding depth. Its focus is on managing material removal as part of the specimen-preparation process.
Understand the instrument in context
Select the instrument together with the material, specimen dimensions, target surface and downstream inspection task.
Explore preparation workflows →Questions before selecting
What specimen information should I provide?
Provide material, geometry, dimensions, target cross-section, batch size, current method and the problem to solve.
Are these specifications the final configuration?
The page supports preliminary selection. Confirm fixtures, consumables, power supply and optional features in the technical proposal.
Can I view an instrument demonstration?
The viewer supports image sequences, animated images and video. Image sequences show appearance and structure; refer to validated videos or instructions for operation.