Grand Debut: Shanghai Yanrun 3D-DIC Full-Field Strain Measurement System Breaks the Limits of Mechanical Measurement

3D-DIC (Digital Image Correlation) technology is a new generation of advanced optical, non-contact measurement solutions. In simple terms, it gives the measured object a unique 'surface fingerprint.' Relying on dual-camera stereo vision, it precisely captures image sequences before and after the object is stressed or the environment changes, and uses intelligent algorithms to track the movement of feature points—achieving a revolutionary leap from single-point measurement to full-field measurement.

Core Advantages

• Non-contact, non-destructive measurement: A purely optical inspection mode with no physical contact interference, fully preserving the intrinsic mechanical properties of the measured object;
• 3D full-field sensing: Accurately reconstructs the full-field distribution of 3D displacement and strain on complex curved surfaces and under large deformation;
• Ultra-high measurement accuracy: Meets sub-pixel inspection standards, turning microscopic mechanical behavior into intuitive, quantifiable color contour maps;
• Wide scenario adaptability: Adapts to extreme conditions such as high temperature, high pressure, and complex components, breaking through the limits of traditional measurement.

Wide Range of Applications

The technology has been deeply deployed in core fields including materials science, aerospace, automotive engineering, biomedicine, and civil engineering. Whether for mechanical property R&D of metals and composites, fatigue strength testing of critical aircraft components, automotive crash structure optimization, long-term health monitoring of bridges and buildings, or mechanical response analysis of biological tissues, it provides accurate and reliable full-field measurement solutions. The company has completed the integration of the full 3D-DIC hardware system and the development of core software algorithms, and will continue to iterate on user interaction, data integration, and intelligent analysis to create an easy-to-use, intelligent one-stop measurement product.